Nanoindentation creep of supercrystalline nanocomposites

被引:0
|
作者
Yan C. [1 ]
Bor B. [2 ]
Plunkett A. [2 ]
Domènech B. [2 ,3 ]
Maier-Kiener V. [4 ]
Giuntini D. [1 ,2 ]
机构
[1] Department of Mechanical Engineering, Eindhoven University of Technology
[2] Institute of Advanced Ceramics, Hamburg University of Technology
[3] ams-OSRAM International GmbH, ams OSRAM Group
[4] Department of Materials Science, Montanuniversität Leoben
来源
Materials and Design | 2023年 / 231卷
关键词
Creep; Nanocomposites; Nanoindentation; Supercrystals;
D O I
10.1016/j.matdes.2023.112000
中图分类号
学科分类号
摘要
Supercrystalline nanocomposites (SCNCs) are inorganic-organic hybrid materials with a unique periodic nanostructure, and thus they have been gaining growing attention for their intriguing functional properties and parallelisms with hierarchical biomaterials. Their mechanical behavior remains, however, poorly understood, even though its understanding and control are important to allow SCNCs’ implementation into devices. An important aspect that has not been tackled yet is their time-dependent deformation behavior, which is nevertheless expected to play an important role in materials containing such a distribution of organic phase. Hereby, we report on the creep of ceramic-organic SCNCs with varying degrees of organic crosslinking, as assessed via nanoindentation. Creep strains and their partial recoverability are observed, hinting at the co-presence of viscoelasticity and viscoplasticity, and a clear effect of crosslinking in decreasing the overall material deformability emerges. We rationalize our experimental observations with the analysis of stress exponent and activation volume, resulting in a power-law breakdown behavior and governing deformation mechanisms occurring at the organic sub-nm interfaces scale, as rearrangement of organic ligands. The set of results is reinforced by the evaluation of the strain rate sensitivity via strain rate jump tests, and the assessment of the effect of oscillations during continuous stiffness measurement mode. © 2023 The Author(s)
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