Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges

被引:6
|
作者
Soon, Chin Fhong [1 ,2 ]
Yee, See Khee [2 ]
Nordin, Anis Nurashikin [3 ]
Ab Rahim, Rosminazuin [3 ]
Ma, Nyuk Ling [4 ]
Abd Hamed, Intan Sue Liana [2 ]
Tee, Kian Sek [2 ]
Azmi, Nur Hanisah [3 ]
Sunar, Norshuhaila Mohamed [5 ]
Heng, Chris [6 ]
机构
[1] Univ Tun Hussein Onn Malaysia, Inst Integrated Engn, Microelect & Nanotechnol Shamsuddin Res Ctr, Batu Pahat 86400, Johor, Malaysia
[2] Univ Tun Hussein Onn Malaysia, Fac Elect & Elect Engn, Batu Pahat 86400, Johor, Malaysia
[3] Int Islam Univ Malaysia, Dept Elect & Comp Engn, Kulliyah Engn, Kuala Lumpur 53100, Malaysia
[4] Univ Malaysia Terengganu, Fac Sci & Marine Environm, BIOSES Res Interest Grp, Kuala Nerus 21030, Terengganu, Malaysia
[5] Univ Tun Hussein Onn Malaysia, Inst Integrated Engn, Soft Soil Res Ctr, Batu Pahat 86400, Johor, Malaysia
[6] Green Innovat & Energy Sdn Bhd, Johor Baharu 80400, Johor, Malaysia
关键词
Biodegradable materials; Decomposition; Fire-retardant board; Sustainability; Printed circuit board; DIELECTRIC-PROPERTIES; FLAX COMPOSITES; SILK FIBROIN; STATE; TRANSPARENT; TECHNOLOGY; COMPONENTS; SUBSTRATE; FIBER; WOOD;
D O I
10.1007/s12541-024-01027-2
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
As electronic waste poses environmental challenges, exploring eco-friendly alternatives becomes imperative. In this review, the introduction reveals the disposal problem of existing printed circuit boards (PCBs) and the potential impacts of implementing biodegradable PCBs towards the United Nations Sustainable Development Goals. Various biodegradable materials, including polylactic acid, cellulose/cellulose acetate, silk proteins, gelatin, polyvinyl alcohol, mycelium, and wood, were evaluated for their properties and suitability in PCB manufacturing. Each material is scrutinised for its suitability in creating environmentally friendly circuit boards. The study meticulously analyses these biodegradable PCBs' electrical, mechanical, thermal and decomposition properties, providing insights into their performance under various conditions. The article also explores different fabrication methods and their advantages and limitations for manufacturing biodegradable PCBs. Solvent and non-solvent based decomposition of the biodegradable PCBs were revealed. The research outcome on a balance between hygroscopic property and degradability of biodegradable PCBs is revealed. The narrative extends to encompass the challenges and issues associated with the Design-for-Manufacturing processes and life cycle assessment of biodegradable PCBs, shedding light on potential hurdles and areas for improvement. The article concludes with a forward-looking perspective on the future of biodegradable printed circuit boards, environmentally friendly fire-retardants, a proposal for alternative standards for biodegradable PCBs, and their increasing role in sustainable electronics.
引用
收藏
页码:1925 / 1954
页数:30
相关论文
共 50 条
  • [21] PRINTED-CIRCUIT BOARDS MEET MOUNTING CHALLENGES
    MORGEN, B
    ELECTRONIC PRODUCTS MAGAZINE, 1984, 27 (06): : 42 - 48
  • [22] PRINTED CIRCUIT BOARDS MEET MOUNTING CHALLENGES.
    Morgen, Bruce
    Electronic Products (Garden City, New York), 1984, 27 (06): : 43 - 48
  • [23] Processing waste printed circuit boards for material recovery
    Hall, William J.
    Williams, Paul T.
    CIRCUIT WORLD, 2007, 33 (04) : 43 - 50
  • [24] Milling and Classification of Printed Circuit Boards for Material Recycling
    Eswaraiah, Chinthapudi
    Soni, Rahul Kumar
    PARTICULATE SCIENCE AND TECHNOLOGY, 2015, 33 (06) : 659 - 665
  • [25] Recent chemical methods for metals recovery from printed circuit boards: A review
    Oke, Emmanuel A.
    Potgieter, Herman
    JOURNAL OF MATERIAL CYCLES AND WASTE MANAGEMENT, 2024, 26 (03) : 1349 - 1368
  • [26] Recent chemical methods for metals recovery from printed circuit boards: A review
    Emmanuel A. Oke
    Herman Potgieter
    Journal of Material Cycles and Waste Management, 2024, 26 : 1349 - 1368
  • [27] Identification of printed circuit boards mechanical properties using response surface methods
    Gharaibeh, Mohammad
    MICROELECTRONICS INTERNATIONAL, 2022, 39 (01) : 38 - 47
  • [28] Printed circuit boards: A review on the perspective of sustainability
    Marques, Andre Canal
    Cabrera, Jose-Maria
    Malfatti, Celia de Fraga
    JOURNAL OF ENVIRONMENTAL MANAGEMENT, 2013, 131 : 298 - 306
  • [29] Investigating Mechanical Performance of PLA and CA Biodegradable Printed Circuit Boards
    Geczy, Attila
    Nagy, Daniel
    Hajdu, Istvan
    Kmetty, Akos
    Szolnoki, Beata
    2015 IEEE 21ST INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME), 2015, : 45 - 49
  • [30] New Fabrication Facilities for Printed-Circuit Boards.
    Augsburg, Gunter
    Hoffman, Manfred
    Wuensche, Hatto
    Siemens-Zeitschrift, 1976, 50 (04): : 222 - 224