Molded electronic package warpage predictive modelling methodologies

被引：0
|
作者：
Ong, Kang Eu [1 ]
Loh, Wei Keat [1 ]
Kulterman, Ron W. [2 ]
Hsu, Chih Chung [3 ]
Wang, Jenn An [3 ]
Fu, Haley [4 ]
机构：
[1] Intel Technology SdnBhd, Malaysia
[2] Flex Ltd, Austin,TX, United States
[3] CoreTech System (Moldex3D), Taiwan
[4] INEMI, Shanghai, China
来源：
2019 International Conference on Electronics Packaging, ICEP 2019 | 2019年
关键词：
D O I：
8733601
中图分类号：
学科分类号：
摘要：
Glass transition
引用
收藏
页码：13 / 19
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