Adhesion incompatible polymer-polymer composites with increased media tightness by sintered microstructures

For protection of electronic components against environmental influences, an innovative surface structuring process based on a sintered powder layer was investigated. The applied treatment process leads to micro undercuts on the insert surface, which can result in an increased bond quality and reduced leakage rates because of labyrinth sealing effects. With this new method, entire assemblies or specific components can be protected by manufacturing in assembly injection molding, which would enable the use of an efficient and mass production suitable process for assembly protection. The results clearly show that an increased pull out force level in combination with a reduced leakage rate can be achieved by means of micro structuring with a sintered powder layer. © Carl Hanser Verlag.