MOLECULAR BONDING MECHANISM FOR SOLID ADHESION

被引:12
|
作者
LEE, LH
机构
[1] Webster Research Center, Xerox Corporation, Webster, New York
来源
JOURNAL OF ADHESION | 1992年 / 37卷 / 1-3期
关键词
ACCEPTOR; ACID; ADHESION; ADHESIVE; BASE; BINDING ENERGY; DONOR; ELECTRON; MOLECULAR BONDING; MOLECULE; ORBITAL; SEPARATION DISTANCE; SOLID; SURFACE;
D O I
10.1080/00218469208031261
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
The purpose of this study is to understand why and how solids can be bonded together with and without an adhesive. Beside van der Waals interactions and chemical bonding, there are some intermediate interactions, such as the Coulombic and charge-transfer interactions. These interactions are also called molecular interactions. Thus, molecular bonding mechanism for solids deals mainly with the formation of an adhesive bond through molecular interactions. The driving forces for molecular interactions are discussed in terms of adhesive energy and separation distance. The functions of electrons are illustrated with molecular orbitals. Moreover, some unique interactions between a molecule and the surface of a solid are demonstrated with the results found by Hoffmann. © 1992, Taylor & Francis Group, LLC. All rights reserved.
引用
收藏
页码:187 / 204
页数:18
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