共 50 条
- [24] Reflow-curable polymer fluxes for flip chip encapsulation Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, 1998, : 6 - 11
- [25] Novel single pass reflow encapsulant for flip chip application INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2000, : 97 - 101
- [26] DYNAMIC BEHAVIOR OF SMT CHIP CAPACITORS DURING SOLDER REFLOW IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1990, 13 (03): : 545 - 552
- [27] Fluxless solder bumping in flip chip package by plasma reflow ADVANCES IN ELECTRONIC MATERIALS AND PACKAGING 2001, 2001, : 139 - 144
- [28] DYNAMIC BEHAVIOR OF SMT CHIP CAPACITORS DURING SOLDER REFLOW SEVENTH IEEE/CHMT INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM: INTEGRATION OF THE MANUFACTURING FLOW - FROM RAW MATERIAL THROUGH SYSTEMS-LEVEL ASSEMBLY, 1989, : 23 - 29
- [29] Reflow-curable polymer fluxes for flip chip encapsulation 1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING, PROCEEDINGS, 1998, : 41 - 46
- [30] Studying the dynamic behaviour of chip components during reflow soldering 2007 30TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, 2007, : 18 - 23