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- [22] REDUCED GOLD-PLATING ON COPPER LEADS FOR THERMOCOMPRESSION BONDING .1. INITIAL CHARACTERIZATION IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1977, 13 (03): : 305 - 309
- [23] A Crunch on Thermocompression Flip Chip Bonding 3RD ELECTRONIC AND GREEN MATERIALS INTERNATIONAL CONFERENCE 2017 (EGM 2017), 2017, 1885
- [24] A SIMPLE PROCESS FOR THE FABRICATION OF PARALLEL-PLATE ELECTROSTATIC MEMS RESONATORS BY GOLD THERMOCOMPRESSION BONDING 2023 IEEE 36TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, MEMS, 2023, : 643 - 646
- [27] THERMOCOMPRESSION BONDING FOR 3D RF MEMS DEVICES USING GOLD AND SILVER AS INTERMEDIATE LAYER 2012 INTERNATIONAL SEMICONDUCTOR CONFERENCE (CAS), VOLS 1 AND 2, 2012, 2 : 183 - 186
- [28] DETERMINING THERMOCOMPRESSION BONDING PARAMETERS BY A FRICTION TECHNIQUE JOURNAL OF METALS, 1965, 17 (07): : 703 - &
- [29] Thermocompression bonding of aluminum bumps in TAB applications 48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 1305 - 1310
- [30] DETERMINING THERMOCOMPRESSION BONDING PARAMETERS BY A FRICTION TECHNIQUE TRANSACTIONS OF THE METALLURGICAL SOCIETY OF AIME, 1966, 236 (03): : 392 - &