AUGER ANALYSIS OF CONTAMINANTS THAT INFLUENCE THERMOCOMPRESSION BONDING OF GOLD

被引：16
|
作者：
MCGUIRE, GE [1 ]
JONES, JV [1 ]
DOWELL, HJ [1 ]
机构：
[1] TEXAS INSTRUMENTS INC,DALLAS,TX 75222
来源：
THIN SOLID FILMS | 1977年 / 45卷 / 01期
关键词：
D O I：
10.1016/0040-6090(77)90204-8
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：59 / 68
页数：10
相关论文
共 50 条
  • [1] CHARACTERIZATION OF GOLD-GOLD THERMOCOMPRESSION BONDING
    AHMED, N
    SVITAK, JJ
    SOLID STATE TECHNOLOGY, 1975, 18 (11) : 25 - 32
  • [2] MECHANISM OF THERMOCOMPRESSION BONDING OF GOLD BEAM LEADS
    HAYASAKA, T
    HATTORI, S
    REVIEW OF THE ELECTRICAL COMMUNICATIONS LABORATORIES, 1975, 23 (3-4): : 344 - 352
  • [3] Critical temperatures in thermocompression gold stud bonding
    Zhang, G. G.
    Ang, X. F.
    Chen, Z.
    Wong, C. C.
    Wei, J.
    JOURNAL OF APPLIED PHYSICS, 2007, 102 (06)
  • [4] Pressure dependence in peripheral bonding in gold-gold thermocompression
    Ang, X. F.
    Zhang, G. G.
    Wei, J.
    Chen, Z.
    Wong, C. C.
    EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2006, : 318 - 323
  • [5] MECHANICS OF GOLD BEAM LEADS DURING THERMOCOMPRESSION BONDING
    DAIS, JL
    IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1976, 12 (03): : 241 - 250
  • [6] Gold wires enhance thermocompression, thermosonic wire bonding
    JEE J Electron Eng, 343 (22-30):
  • [7] Temperature and pressure dependence in thermocompression gold stud bonding
    Ang, XF
    Zhang, GG
    Wei, J
    Chen, Z
    Wong, CC
    THIN SOLID FILMS, 2006, 504 (1-2) : 379 - 383
  • [8] Finite element modelling of flip chip gold-gold thermocompression bonding
    Puigcorbé, J
    Marco, S
    Leseduarte, S
    Carmona, M
    Vendier, O
    Devron, C
    Delage, SL
    Floriot, D
    Blanck, H
    JOURNAL OF ELECTRONIC PACKAGING, 2003, 125 (04) : 549 - 555
  • [9] Study on the Gold-Gold Thermocompression Bonding for Wafer-level Packaging
    Wu, Jing
    Jia, Shixing
    Wang, Yunxiang
    Zhu, Jian
    MICRO AND NANO TECHNOLOGY: 1ST INTERNATIONAL CONFERENCE OF CHINESE SOCIETY OF MICRO/NANO TECHNOLOGY(CSMNT), 2009, 60-61 : 325 - +
  • [10] Large Wafer GaN on Silicon Reconstitution with Gold-to-Gold Thermocompression Bonding
    Kuchhangi, Ankit
    Ren, Haoxiang
    Sahoo, Krutikesh
    Iyer, Subramanian S.
    2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023, : 1633 - 1637
12345