BONDING KINETICS OF THERMOSETTING ADHESIVE SYSTEMS USED IN WOOD-BASED COMPOSITES - THE COMBINED EFFECT OF TEMPERATURE AND MOISTURE-CONTENT

被引：12
|
作者：
HUMPHREY, PE
REN, S
机构：
来源：
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY | 1989年 / 3卷 / 05期
关键词：
D O I：
10.1163/156856189X00290
中图分类号：
TQ [化学工业];
学科分类号：
0817 ;
摘要：
引用
收藏
页码：397 / 413
页数：17
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