COPPER THICK-FILM MATERIALS - A PERSPECTIVE

被引:0
|
作者
COX, JJ
机构
关键词
Compendex;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
FILMS
引用
收藏
页码:150 / 152
页数:3
相关论文
共 50 条
  • [21] MATERIALS FOR THICK-FILM TECHNOLOGY - STATE OF ART
    DECOURSEY, DT
    SOLID STATE TECHNOLOGY, 1968, 11 (06) : 29 - +
  • [22] ENVIRONMENTAL-EFFECTS ON COPPER THICK-FILM MICROCIRCUITS
    PITKANEN, DE
    SPEERSCHNEIDER, CJ
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1981, 4 (03): : 250 - 256
  • [23] SINTERING OF THICK-FILM COPPER METALLURGY - A THERMOCHEMICAL VIEW
    MASTER, RN
    HERRON, LW
    AMERICAN CERAMIC SOCIETY BULLETIN, 1980, 59 (03): : 378 - 378
  • [24] CONTROLLED QUALITY TESTING OF MATERIALS USED IN THICK-FILM MATERIALS
    ANJARD, RP
    KIRSCHENMAN, K
    AMERICAN CERAMIC SOCIETY BULLETIN, 1982, 61 (09): : 944 - 944
  • [25] SURFACE TREATMENTS AND BONDABILITY OF COPPER THICK-FILM CIRCUITS
    LIU, TS
    PITKANEN, DE
    MCIVER, CH
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1981, 4 (04): : 417 - 424
  • [26] COPPER AND SILVER CONTAMINATION OF THICK-FILM GOLD SURFACES
    PANOUSIS, NT
    THIN SOLID FILMS, 1979, 64 (01) : 41 - 45
  • [27] EFFECTS OF ADDITIVES ON PROPERTIES OF THICK-FILM COPPER CONDUCTORS
    KUO, CY
    AMERICAN CERAMIC SOCIETY BULLETIN, 1982, 61 (08): : 815 - 815
  • [28] Thick-film piezoelectric materials for high temperature applications
    Beeby, SP
    Torah, RN
    Grabham, N
    Tudor, MJ
    White, NM
    FERROELECTRICS, 2004, 313 : 63 - 69
  • [29] THE INFLUENCE OF FAST INFRARED FIRING ON THICK-FILM MATERIALS
    BUBE, KR
    FISHER, C
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1983, 6 (04): : 436 - 442
  • [30] Preparation and properties of new thick-film magnetoresistive materials
    Bianco, A
    Montesperelli, G
    Gusmano, G
    Morten, B
    DeCicco, G
    Masoero, A
    Tombesi, P
    Prudenziati, M
    SENSORS AND ACTUATORS A-PHYSICAL, 1996, 52 (1-3) : 161 - 165