CHARACTERIZATION OF HIGH TEMPERATURE MATERIALS USING NONDESTRUCTIVE TEST TECHNIQUES

被引：0

|

作者：

STINEBRI.RC

机构：

来源：

AMERICAN CERAMIC SOCIETY BULLETIN | 1969年 / 48卷 / 04期

关键词：

D O I：

暂无

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

收藏

页码：485 / &

相关论文

共 50 条

[1] High temperature materials characterization enhanced by nondestructive imaging
Pilgrim, S.M.
Glass Researcher, 2001, 10-11 (2-1): : 42 - 43
[2] Ultrasonic nondestructive techniques for materials characterization
Matikas, TE
Crane, RL
MRS BULLETIN, 1996, 21 (10) : 18 - 19
[3] Noncontact acoustical techniques for nondestructive characterization of materials and structures
Green Jr. R.E.
International Applied Mechanics, 2002, 38 (3) : 253 - 259
[4] Noncontact acoustical techniques for nondestructive characterization of materials and structures
Green, RE
INTERNATIONAL APPLIED MECHANICS, 2002, 38 (03) : 253 - 259
[5] TEST TECHNIQUES FOR HIGH-TEMPERATURE STRUCTURAL-MATERIALS
HEIDENREICH, R
PAPENBURG, U
SCHAFER, R
MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK, 1994, 25 (01) : 30 - 38
[6] ANALYTICAL TECHNIQUES FOR THE CHARACTERIZATION OF HIGH-TEMPERATURE SUPERCONDUCTING MATERIALS
RUSSO, RE
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1990, 200 : 56 - IEC
[7] Nondestructive variable temperature materials characterization for semiconductor research
Lake Shore Cryotronics Inc., 575 McCorkle Blvd., Westerville
OH
43082, United States
Adv Mater Processes, 10 (20-22):
[8] Nondestructive Variable Temperature Materials Characterization for Semiconductor Research
Phillips, Andy
ADVANCED MATERIALS & PROCESSES, 2014, 172 (10): : 20 - 22
[9] Residual stress characterization in structural materials by destructive and nondestructive techniques
Roy, AK
Venkatesh, A
Marthandam, V
Dronavalli, SB
Wells, D
Rogge, R
JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2005, 14 (02) : 203 - 211
[10] Development of Nondestructive Techniques for Characterization of Residual Stresses in Advanced Materials
Lasseigne, A. N.
Olson, D. L.
MATERIALS EVALUATION, 2008, 66 (10) : 1077 - 1083

← 1 2 3 4 5 →