EFFECTS OF BAKEOUTS ON CHARACTERISTICS OF MULTILAYER PRINTED-CIRCUIT BOARDS

被引：0

作者：

BOCCIA, LJ

机构：

来源：

PLATING AND SURFACE FINISHING | 1982年 / 69卷 / 03期

关键词：

D O I：

暂无

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

引用

页码：68 / 72

页数：5

共 50 条

[21] SOLDERING OF SMDS ON PRINTED-CIRCUIT BOARDS
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