INTERFACIAL STABILITY OF PLANAR SOLID-LIQUID INTERFACE DURING UNIDIRECTIONAL SOLIDIFICATION OF AL-ZN ALLOY

被引：27
|
作者：
SATO, T [1 ]
ITO, K [1 ]
OHIRA, G [1 ]
机构：
[1] TOHOKU UNIV,GRAD SCH,SENDAI,MIYAGI 980,JAPAN
来源：
TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS | 1980年 / 21卷 / 07期
关键词：
D O I：
10.2320/matertrans1960.21.441
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
引用
收藏
页码：441 / 448
页数：8
相关论文
共 50 条
  • [21] INSTABILITY OF A SMOOTH SOLID-LIQUID INTERFACE DURING SOLIDIFICATION
    WALTON, D
    TILLER, WA
    RUTTER, JW
    WINEGARD, WC
    TRANSACTIONS OF THE AMERICAN INSTITUTE OF MINING AND METALLURGICAL ENGINEERS, 1955, 203 (09): : 1023 - 1026
  • [22] Influence of solidification rate on solid-liquid interface in unidirectional solidification microstructure of austenitic stainless steel
    Liu, Xu-Feng
    Li, Qiu-Shu
    Du, Wei-Dong
    Li, Ren-Xing
    Zhai, Qi-Jie
    Cailiao Kexue yu Gongyi/Material Science and Technology, 2009, 17 (01): : 110 - 112
  • [23] Cellular breakdown of the planar interface in unidirectional solidification of Al- Cu alloy
    SATO T
    OHIRA G
    1971, 12 (04): : 285 - 294
  • [24] CELLULAR BREAKDOWN OF PLANAR INTERFACE IN UNIDIRECTIONAL SOLIDIFICATION OF AL-CU ALLOY
    SATO, T
    OHIRA, G
    TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS, 1971, 12 (04): : 285 - &
  • [25] Predicting solid-liquid interfacial characteristics during rapid solidification
    Pal, P.
    Phillion, A. B.
    COMPUTATIONAL MATERIALS SCIENCE, 2022, 213
  • [26] Experimental determination of solid-liquid interfacial free energy anisotropy in Al-Zn via equilibrium droplet method
    Nan, Ruibin
    Shuai, Sansan
    Huang, Chenglin
    Wang, Zekun
    Hu, Tao
    Chen, Chaoyue
    Xu, Songzhe
    Wang, Jiang
    Ren, Zhongming
    MATERIALS LETTERS, 2023, 351
  • [27] STABILITY OF A PLANAR SOLID-LIQUID INTERFACE FOR ALLOYS OF INDIUM IN TIN
    DAVIS, KG
    FRYZUK, P
    JOURNAL OF CRYSTAL GROWTH, 1971, 8 (01) : 57 - &
  • [28] Distribution of solute at solid-liquid interface during solidification of melt
    Fukui, K
    Maeda, K
    JOURNAL OF CHEMICAL PHYSICS, 1998, 109 (17): : 7468 - 7473
  • [29] Studies of solid-liquid interface behaviors during solidification process
    Kim, J.-H.
    TMS Annual Meeting, 1992,
  • [30] STABILITY OF PLANAR INTERFACE DURING SOLIDIFICATION OF DILUTE BINARY ALLOY
    MULLINS, WW
    SEKERKA, RF
    JOURNAL OF APPLIED PHYSICS, 1964, 35 (02) : 444 - &
12345