A NEW SLICING AND DICING SAW

被引:0
|
作者
JENSEN, EW
JACOBSEN, HR
机构
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:53 / &
相关论文
共 50 条
  • [41] Dicing saw process optimization on die crack during IC packaging
    Wang, ZJ
    Jiang, YW
    ISTM/2005: 6th International Symposium on Test and Measurement, Vols 1-9, Conference Proceedings, 2005, : 4806 - 4810
  • [42] Improving IC reliability by reducing chipping defect in dicing saw process
    Zhang, Z
    PROCEEDINGS OF THE 1ST INTERNATIONAL CONFERENCE ON RELIABILITY OF ELECTRICAL PRODUCTS AND ELECTRICAL CONTACTS, 2004, : 330 - 333
  • [43] An artificial neural network approach for wafer dicing saw quality prediction
    Su, Te-Jen
    Chen, Yi-Feng
    Cheng, Jui-Chuan
    Chiu, Chien-Liang
    MICROELECTRONICS RELIABILITY, 2018, 91 : 257 - 261
  • [44] Slicing and Dicing: Optimal Coarse-Grained Representation to Preserve Molecular Kinetics
    Yang, Wangfei
    Templeton, Clark
    Rosenberger, David
    Bittracher, Andreas
    Nueske, Feliks
    Noe, Frank
    Clementi, Cecilia
    ACS CENTRAL SCIENCE, 2023, : 186 - 196
  • [45] Experimental Study on Temperature during Wire Saw Slicing
    Yao, Chunyan
    Xu, Zonghua
    Zhang, Wei
    Zhang, Qiaofang
    Peng, Wei
    QUANTUM, NANO, MICRO TECHNOLOGIES AND APPLIED RESEARCHES, 2014, 481 : 153 - 157
  • [46] VIBRATION CHARACTERISTICS OF CRYSTAL SLICING ID SAW BLADES
    FORMAN, SE
    RHINES, WJ
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1972, 119 (06) : 686 - &
  • [47] Relationship between slurry actions in slicing groove and slicing characteristics at multi-wire saw
    Ishikawa, Ken-Ichi
    Suwabe, Hitoshi
    Itoh, Shun-Ichi
    Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering, 2003, 69 (12): : 1739 - 1743
  • [48] 300-mm low-k wafer dicing saw development
    Wang, ZhiJie
    Wang, J. H.
    Lee, Stephen
    Yao, SuYing
    Han, Richard
    Su, Yeqing Q.
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2007, 30 (04): : 313 - 319
  • [49] Visual recipes for slicing and dicing data: teaching data wrangling using subgoal graphics
    Sundin, Lovisa
    Sakr, Nourhan
    Leinonen, Juho
    Aly, Sherif
    Cutts, Quintin
    PROCEEDINGS OF 21ST KOLI CALLING CONFERENCE ON COMPUTING EDUCATION RESEARCH, KOLI CALLING 2021,, 2021,
  • [50] BEYOND SLICING AND DICING: CYSTEINE PROTEASE CATHEPSIN K A NOVEL TARGET FOR CARDIOMETABOLIC DISEASE
    Nair, S.
    CARDIOLOGY, 2017, 137 : 121 - 121