FACTORS INFLUENCING THE BREAKDOWN SUSCEPTIBILITY OF THE PASSIVE FILM ON CU-NI ALLOY

被引:22
|
作者
MILOSEV, I [1 ]
METIKOSHUKOVIC, M [1 ]
机构
[1] UNIV ZAGREB, FAC TECHNOL,INST ELECTROCHEM, YU-41001 Zagreb, YUGOSLAVIA
关键词
COPPER-NICKEL ALLOY; LOCALIZED BREAKDOWN; PASSIVITY; PITTING CORROSION;
D O I
10.5006/1.3315924
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Cyclic voltammetry and current transients, complemented with Auger electron analysis in conjunction with argon ion sputtering, were used to establish the mechanism of passivity breakdown on 9OCu-10Ni alloy in borate buffer, pH = 9.25, containing chloride ions. The incubation time, t(i), and the induction time, tau, appear as characteristic time parameters, indicating that different stages are involved in the overall breakdown process. A model of passivity breakdown with the onset of pitting corrosion is proposed, taking into consideration a duplex structure of the passive film, which is composed of an inner Cu2O layer and an outer CuO layer. Auger depth analysis revealed that the extent of Cl- incorporation into the oxide film is highly dependent upon previous anodic treatment, as well as upon time of exposure to the chloride-containing solution. The results are discussed in terms of improving resistance toward breakdown with increasing perfection of the passive film.
引用
收藏
页码:185 / 193
页数:9
相关论文
共 50 条
  • [31] MICROSCOPIC OBSERVATION OF THE SOLIDIFICATION OF CU-NI ALLOY DROPLETS
    CECH, RE
    TURNBULL, D
    TRANSACTIONS OF THE AMERICAN INSTITUTE OF MINING AND METALLURGICAL ENGINEERS, 1951, 191 (03): : 242 - 243
  • [32] Composition formulas of Cu-Ni industrial alloy specifications
    Hong, Hailian
    Wang, Qing
    Dong, Chuang
    SCIENCE CHINA-MATERIALS, 2015, 58 (05) : 355 - 362
  • [33] Molecular dynamics simulation on structures of Cu-Ni alloy
    Cong, HR
    Bian, XF
    Li, H
    Wang, L
    CHINESE JOURNAL OF CHEMICAL PHYSICS, 2002, 15 (04): : 288 - 294
  • [34] QUANTITATIVE-DETERMINATION OF THE PASSIVE LAYER ON CU-NI ALLOYS
    DRUSKA, P
    STREHBLOW, HH
    SURFACE AND INTERFACE ANALYSIS, 1995, 23 (7-8) : 440 - 450
  • [35] EHMO EXAMINATION OF CATALYTIC ACTIVITY OF CU-NI ALLOY
    ITOH, H
    JAPANESE JOURNAL OF APPLIED PHYSICS, 1974, : 497 - 500
  • [36] Fabrication and Calibration of Cu-Ni Thin Film Thermocouples
    Guo Hang
    Jiang Jun Ying
    Liu Jia Xing
    Nie Zhi Hua
    Ye Fang
    Ma Chong Fang
    RENEWABLE AND SUSTAINABLE ENERGY II, PTS 1-4, 2012, 512-515 : 2068 - +
  • [37] Influence of La addition on the semi-conductive properties of passive films formed on Cu-Ni alloy
    Leng, Xiang
    Zhang, Yadong
    Zhou, Qiongyu
    Zhang, Yinghui
    Wang, Zhigang
    Wang, Hang
    Yang, Bin
    MATERIALS RESEARCH EXPRESS, 2018, 5 (05):
  • [38] EFFECT OF ELECTRON CONFIGURATION ON PASSIVE PROPERTIES OF CU-NI ALLOYS
    UHLIG, HH
    ELECTROCHIMICA ACTA, 1971, 16 (11) : 1939 - &
  • [39] Facile preparation of porous Cu, Ni, and Cu-Ni alloy as electrodes for supercapacitor application
    Komal, Nitasha
    Ali, Ghulam
    Sohail, Manzar
    Mazhar, Muhammad
    Malik, Zahida
    Wattoo, M. Hamid Sarwar
    MATERIALS CHEMISTRY AND PHYSICS, 2023, 295
  • [40] HALL EFFECT, MAGNETIC SUSCEPTIBILITY AND RESISTIVITY OF CU-NI ALLOYS
    FEDOROV, GV
    RYABININ.NM
    PHYSICS OF METALS AND METALLOGRAPHY-USSR, 1970, 29 (01): : 82 - &