PACKAGING TECHNOLOGY OF ULTRATHIN FILM SENSORS BY ELECTRON-BEAM WELDING

In this paper, the packaging welding technology of ultrathin film sensors by an electron beam is discussed. It is interesting to note that the thickness of the film of a piezoelectric-type pressure sensor is only 0.05 mm. Welding for the film and shell has been provided by edge joint welding. The thicknesses of the substrate or tube wall of the film-type temperature-sensitive probe and the tube-type strain sensor are only 0.10-0.15 mm. Welding for the upper and lower substrates and thin tube of a strain sensor has been provided by semi-penetrating joint welding. The results of the electron-beam welding appear to be satisfactory.