THERMAL MANAGEMENT OF AIR-COOLED AND LIQUID-COOLED MULTICHIP MODULES

被引：49
|
作者：
BARCOHEN, A [1 ]
机构：
[1] UNIV MINNESOTA,DEPT MECH ENGN,MINNEAPOLIS,MN 55455
来源：
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1987年 / 10卷 / 02期
关键词：
D O I：
10.1109/TCHMT.1987.1134734
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：159 / 175
页数：17
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