共 50 条
- [31] QFP improvement for high temperature reflow soldering NEC RESEARCH & DEVELOPMENT, 2000, 41 (03): : 294 - 297
- [32] QFP improvement for high temperature reflow soldering NEC Research and Development, 2000, 41 (03): : 294 - 297
- [34] INFLUENCE ON HIGH-TEMPERATURE MECHANICAL STRENGTH OF HIGH-TEMPERATURE CORROSION WERKSTOFFE UND KORROSION-MATERIALS AND CORROSION, 1983, 34 (11): : 527 - 538
- [35] Ultrasonic-assisted soldering of Sn-based alloys during die bonding for high-temperature application 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
- [36] Effect of annealing and high-temperature heatings during soldering on structure and mechanical properties of alloy based on nickel aluminide Inorganic Materials: Applied Research, 1600, Maik Nauka Publishing / Springer SBM (05): : 392 - 398
- [37] Design of lead-free candidate alloys for high-temperature soldering based on the Au-Sn system MATERIALS & DESIGN, 2010, 31 (10): : 4638 - 4645
- [38] Ultrasonic-assisted soldering of Sn/Ni composite solder during die bonding for high-temperature application 2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 295 - 300
- [40] HIGH-TEMPERATURE CORROSION AND PROTECTIVE LAYERS AGAINST HIGH-TEMPERATURE CORROSION METALL, 1976, 30 (04): : 326 - 331