HIGH-FREQUENCY MEASUREMENTS OF CAPACITANCES OF HIGH LOSSY MATERIALS AND THEIR APPLICATIONS

被引：0
|
作者：
MASUDA, Y [1 ]
ICHIJO, B [1 ]
机构：
[1] SHIZUOKA UNIV,SHIZUOKA,JAPAN
来源：
ELECTRICAL COMMUNICATION | 1973年 / 93卷 / 02期
关键词：
D O I：
10.1002/eej.4390930206
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：34 / 42
页数：9
相关论文
共 50 条
  • [41] HIGH-FREQUENCY PERMEABILITY OF FERROMAGNETIC MATERIALS
    EICHHOLZ, G
    HODSMAN, GF
    NATURE, 1947, 160 (4061) : 302 - 303
  • [42] Perusing Materials For High-Frequency PCBs
    Browne, Jack
    MICROWAVES & RF, 2013, 52 (11) : 42 - +
  • [43] EFFECTS OF HIGH-FREQUENCY LOADING ON MATERIALS
    MIGNOGNA, RB
    GREEN, RE
    INTERNATIONAL JOURNAL OF FATIGUE, 1982, 4 (04) : 241 - 241
  • [44] Characterization of Low-Loss Dielectric Materials for High-Speed and High-Frequency Applications
    Lee, Tzu-Nien
    Lau, John-H
    Ko, Cheng-Ta
    Xia, Tim
    Lin, Eagle
    Yang, Kai-Ming
    Lin, Puru-Bruce
    Peng, Chia-Yu
    Chang, Leo
    Chen, Jia-Shiang
    Fang, Yi-Hsiu
    Liao, Li-Yueh
    Charn, Edward
    Wang, Jason
    Tseng, Tzyy-Jang
    MATERIALS, 2022, 15 (07)
  • [45] SC INTEGRATOR FOR HIGH-FREQUENCY APPLICATIONS
    FISCHER, G
    MOSCHYTZ, GS
    ELECTRONICS LETTERS, 1983, 19 (13) : 495 - 496
  • [46] Multifunctional substrates for high-frequency applications
    Gong, X
    Chappell, WJ
    Katehi, LPB
    IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2003, 13 (10) : 428 - 430
  • [47] Conductive adhesives for high-frequency applications
    Sihlbom, R
    Dernevik, M
    Lai, ZH
    Starski, P
    Liu, J
    PEP '97 : THE FIRST IEEE INTERNATIONAL SYMPOSIUM ON POLYMERIC ELECTRONICS PACKAGING - PROCEEDINGS, 1997, : 123 - 130
  • [48] On applications of high-frequency asymptotics in aeroacoustics
    Peake, N
    PHILOSOPHICAL TRANSACTIONS OF THE ROYAL SOCIETY OF LONDON SERIES A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES, 2004, 362 (1816): : 673 - 696
  • [49] SiC MESFETs for High-Frequency Applications
    S. Sriram
    A. Ward
    J. Henning
    S. T. Allen
    MRS Bulletin, 2005, 30 : 308 - 311
  • [50] Conductive adhesives for high-frequency applications
    Sihlbom, R
    Dernevik, M
    Lai, ZH
    Starski, JP
    Liu, JH
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1998, 21 (03): : 469 - 477
12345