Analysis of mutual capacitance and inductance of printed circuit.

被引：0
|
作者：
Ivanov, V. G. [1 ]
机构：
[1] Volodymyr Dahl East Ukrainian Natl Univ, Chem Technol Inst, 31 Lenin Str, UA-93009 Rubizhne, Lugansk Region, Ukraine
来源：
ELECTRICAL ENGINEERING & ELECTROMECHANICS | 2014年 / 04期
关键词：
mutual capacitance and mutual inductance; multi-channel model;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The article analyzes the mutual capacitance and inductance of printed circuit and introduces an evaluation technique for conductor-to-conductor capacitance under electrical connections tracing, the technique based on a multi-layer channel model.
引用
收藏
页码：22 / 24
页数：3
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