Analysis of mutual capacitance and inductance of printed circuit.

被引：0

作者：

Ivanov, V. G. ^{[1
]}

机构：

[1] Volodymyr Dahl East Ukrainian Natl Univ, Chem Technol Inst, 31 Lenin Str, UA-93009 Rubizhne, Lugansk Region, Ukraine

来源：

ELECTRICAL ENGINEERING & ELECTROMECHANICS | 2014年 / 04期

关键词：

mutual capacitance and mutual inductance; multi-channel model;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The article analyzes the mutual capacitance and inductance of printed circuit and introduces an evaluation technique for conductor-to-conductor capacitance under electrical connections tracing, the technique based on a multi-layer channel model.

引用

页码：22 / 24

页数：3

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