CU-NI-SI ALLOY FLAT SPRING

被引:0
|
作者
NISHIHATA, M
SEKIYA, T
JITSU, H
机构
来源
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:726 / +
页数:1
相关论文
共 50 条
  • [41] Influence of Cooling Rate on Solidification and Segregation Characteristics of Cu-Ni-Si Alloy
    Cao, Guangming
    Li, Ruixiang
    Zhang, Shuang
    Wang, Hao
    Zhang, Yuanxiang
    JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2024, 33 (03) : 1274 - 1282
  • [42] Progress of study on super-high strength Cu-Ni-Si alloy
    School of Materials Science and Engineering, Central South University, Changsha 410083, China
    不详
    Jinshu Rechuli/Heat Treatment of Metals, 2007, 32 (07): : 55 - 59
  • [43] An examination of microstructural evolution in a Cu-Ni-Si alloy processed by HPT and ECAP
    Khereddine, Abdel Yazid
    Larbi, Faycal Hadj
    Kawasaki, Megumi
    Baudin, Thierry
    Bradai, Djamel
    Langdon, Terence G.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2013, 576 : 149 - 155
  • [44] Influence of Cooling Rate on Solidification and Segregation Characteristics of Cu-Ni-Si Alloy
    Guangming Cao
    Ruixiang Li
    Shuang Zhang
    Hao Wang
    Yuanxiang Zhang
    Journal of Materials Engineering and Performance, 2024, 33 : 1274 - 1282
  • [45] Mechanical behaviour and microstructure of heat-treated Cu-Ni-Si alloy
    Stavroulakis, Paul
    Toulfatzis, Anagnostis
    Vazdirvanidis, Athanasios
    Pantazopoulos, George
    Papaefthymiou, Spyros
    MATERIALS SCIENCE AND TECHNOLOGY, 2020, 36 (08) : 939 - 948
  • [46] Effect of misorientation of grain boundaries on the discontinuous precipitates of Cu-Ni-Si alloy
    Liao, Xianfeng
    Li, Linhan
    Ren, Kalubi
    Jia, Yanlin
    Pang, Yong
    Xiao, Zhu
    Jiang, Yanbin
    Li, Zhou
    JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2023, 26 : 2060 - 2069
  • [47] TEMPER CONDITION AND FRACTURE TOUGHNESS OF Cu-Ni-Si (CORSON) ALLOY.
    Ueyama, N.
    Takano, T.
    Takeda, M.
    Kuroyanagi, T.
    Akasaka, K.
    Furukawa Denko Jiho/ Furukawa Electric Review, 1980, (70): : 11 - 18
  • [48] Phase transformation behaviors and properties of a high strength Cu-Ni-Si alloy
    Lei, Qian
    Xiao, Zhu
    Hu, Weiping
    Derby, Benjamin
    Li, Zhou
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 697 : 37 - 47
  • [49] Study on cold deformation and dynamic recrystallization behavior of Cu-Ni-Si alloy
    Zhang, Yi
    Liu, Ping
    Tian, Bao-Hong
    Jia, Shu-Guo
    Fan, Li
    Gongneng Cailiao/Journal of Functional Materials, 2010, 41 (03): : 446 - 449
  • [50] Simple optimization for strength and conductivity of Cu-Ni-Si alloy with discontinuous precipitation
    Ahn, Jee Hyuk
    Han, Seung Zeon
    Choi, Eun-Ae
    Lee, Geun Young
    Kim, Kwangho
    Lee, Jehyun
    Han, Heung Nam
    MATERIALS CHARACTERIZATION, 2022, 184