APPLICATION OF LINE-EDGE PROFILE SIMULATION TO THIN-FILM DEPOSITION PROCESSES

被引：28
|
作者：
NEUREUTHER, AR [1 ]
TING, CH [1 ]
LIU, CY [1 ]
机构：
[1] IBM CORP,RES LAB,SAN JOSE,CA 95193
来源：
IEEE TRANSACTIONS ON ELECTRON DEVICES | 1980年 / 27卷 / 08期
关键词：
D O I：
10.1109/T-ED.1980.20055
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：1449 / 1455
页数：7
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