CASE STUDIES IN SYSTEM BURN-IN

被引：2
|
作者：
JENSEN, F
机构：
来源：
RELIABILITY ENGINEERING & SYSTEM SAFETY | 1982年 / 3卷 / 01期
关键词：
D O I：
10.1016/0143-8174(82)90019-1
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：13 / 22
页数：10
相关论文
共 50 条
  • [41] AN INVESTIGATION OF BURN-IN PROBLEM
    LAWRENCE, MJ
    TECHNOMETRICS, 1966, 8 (01) : 61 - &
  • [42] Burn-in effect on yield
    Kim, T
    Kuo, W
    Chien, WTK
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2000, 23 (04): : 293 - 299
  • [43] Burn-in: The confusion continues
    Jensen, F
    QUALITY AND RELIABILITY ENGINEERING INTERNATIONAL, 1997, 13 (02) : 57 - 57
  • [44] Burn-in acceleration considerations in 90nm system LSI
    Wakai, Nobuyuki
    Kobira, Yuji
    Oishi, Tamotsu
    Yamasaki, Shinichi
    Egawa, Hidemitsu
    2006 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP, FINAL REPORT, 2006, : 171 - +
  • [45] PRODUCTION SYSTEM FACILITATES BARE-DIE TEST AND BURN-IN
    MALINIAK, D
    ELECTRONIC DESIGN, 1994, 42 (17) : 36 - +
  • [46] A PTAS for semiconductor burn-in scheduling
    Deng, XT
    Feng, HD
    Li, GJ
    Shi, BY
    JOURNAL OF COMBINATORIAL OPTIMIZATION, 2005, 9 (01) : 1 - 13
  • [47] BURN-IN MODELS AND METHODS - A REVIEW
    LEEMIS, LM
    BENEKE, M
    IIE TRANSACTIONS, 1990, 22 (02) : 172 - 180
  • [48] BURN-IN OF INCANDESCENT SIGN LAMPS
    RAWICZ, AH
    IEEE TRANSACTIONS ON RELIABILITY, 1986, 35 (04) : 375 - 376
  • [49] Single chip test and burn-in
    Forster, J
    Gilg, L
    50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 810 - 814
  • [50] Electrified track system helps simplify burn-in test procedures
    Slack, Laurie J.
    Electronic manufacturing, 1988, 34 (11):
12345