PEEL STRENGTH AND FAILURE MECHANISMS IN OXIDIZED COPPER-POLYETHYLENE LAP JOINTS BONDED WITH FLEXIBLE EPOXY

被引：9
|
作者：
WANG, TT
VAZIRANI, HN
机构：
来源：
JOURNAL OF ADHESION | 1972年 / 4卷 / 04期
关键词：
D O I：
10.1080/00218467208075013
中图分类号：
TQ [化学工业];
学科分类号：
0817 ;
摘要：
引用
收藏
页码：353 / &
相关论文
共 41 条
  • [21] Adherend surface morphology and its influence on the peel strength of adhesive joints bonded with modified phenolic and epoxy structural adhesives
    1600, Publ by Butterworth-Heinemann Ltd, Oxford, Engl (14):
  • [22] Mechanical strength of single-lap joints bonded with nano graphene and MWCNT reinforced epoxy-based nanocomposite adhesives
    Eryildiz, Erdem
    Uysal, Alper
    Altan, Erhan
    MATERIALS TESTING, 2019, 61 (04) : 349 - 352
  • [23] Surface Modification for Enhanced Lap Shear Strength of the Epoxy-Bonded Joints Consisting of Metallic Adherents and Similar/Dissimilar Materials
    Zhang, Yucheng
    Hasegawa, Koichi
    Kamo, Sota
    Takagi, Kiyoka
    Takahara, Atsushi
    ACS APPLIED POLYMER MATERIALS, 2023, 5 (07) : 5381 - 5389
  • [24] On joint strengths, peel stresses and failure modes in adhesively bonded double-strap and supported single-lap GFRP joints
    Lee, H. K.
    Pyo, S. H.
    Kim, B. R.
    COMPOSITE STRUCTURES, 2009, 87 (01) : 44 - 54
  • [25] Performance and failure assessment of adhesively bonded non-crimp fabric carbon fiber/epoxy composite single lap joints
    Dehaghani, Ramin Chitsaz
    Cronin, Duane
    Montesano, John
    INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2021, 105
  • [26] ADHEREND SURFACE-MORPHOLOGY AND ITS INFLUENCE ON THE PEEL STRENGTH OF ADHESIVE JOINTS BONDED WITH MODIFIED PHENOLIC AND EPOXY STRUCTURAL ADHESIVES
    SARGENT, JP
    INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 1994, 14 (01) : 21 - 30
  • [27] High peel strength and excellent solder heat-resistance epoxy adhesive for flexible copper clad laminate
    Li, Anqin
    He, Hui
    Shen, Yue
    Li, Qunyang
    JOURNAL OF APPLIED POLYMER SCIENCE, 2023,
  • [28] High peel strength and excellent solder heat-resistance epoxy adhesive for flexible copper clad laminate
    Li, Anqin
    He, Hui
    Shen, Yue
    Li, Qunyang
    JOURNAL OF APPLIED POLYMER SCIENCE, 2023, 140 (43)
  • [29] Comparison of shear strength and failure mechanisms of lap joint between REBCO tapes bonded by different joining techniques
    Aparicio, Luis Ernesto
    Ito, Satoshi
    Hashizume, Hidetoshi
    FUSION ENGINEERING AND DESIGN, 2018, 136 : 1196 - 1201
  • [30] Influence of water immersion on the single-lap shear strength of aluminum joints bonded with aluminum-powder-filled epoxy adhesive
    Al-Harthi, M
    Kahraman, R
    Yilbas, B
    Sunar, M
    Aleem, BJA
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2004, 18 (15-16) : 1699 - 1710
12345