DIELECTRIC INTEGRITY OF THIN THERMAL OXIDES ON SILICON

被引:2
|
作者
BROZEK, T
JAKUBOWSKI, A
机构
[1] Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, 00-662 Warsaw
关键词
D O I
10.1016/0026-2714(93)90077-C
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The role of silicon dioxide layers in microelectronics and the importance of their integrity are undisputable. From passivating coatings and masking layers for diffusion to ultra-thin tunneling films - all the silicon technology could not exist without silicon dioxide. This review deals with some aspects of the integrity of thin silicon dioxide films for VLSI applications. The problems of dielectric strength and wear-out are considered from the point of view of their mechanisms, models, oxide processing dependence, testing, and measuring. A brief presentation of statistical approaches commonly applied to reliability topics is also included.
引用
收藏
页码:1637 / 1656
页数:20
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