HIGH-TEMPERATURE THICK-FILM DIELECTRIC

被引:0
|
作者
CHIOU, R [1 ]
VEST, RW [1 ]
机构
[1] PURDUE UNIV,W LAFAYETTE,IN 47907
来源
AMERICAN CERAMIC SOCIETY BULLETIN | 1980年 / 59卷 / 03期
关键词
D O I
暂无
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
引用
收藏
页码:378 / 378
页数:1
相关论文
共 50 条
  • [21] GALVANIC EFFECTS IN THICK-FILM DIELECTRIC LAYERS
    SHORT, OA
    HOFFMAN, LC
    ROSENBERG, RM
    AMERICAN CERAMIC SOCIETY BULLETIN, 1973, 52 (09): : 713 - 714
  • [22] GALVANIC EFFECTS IN THICK-FILM DIELECTRIC LAYERS
    SHORT, OA
    HOFFMAN, LC
    ROSENBERG, RM
    AMERICAN CERAMIC SOCIETY BULLETIN, 1973, 52 (04): : 377 - 377
  • [23] AC CONDUCTION IN THICK-FILM DIELECTRIC COMPOSITES
    GOLONKA, LJ
    NITSCH, K
    THIN SOLID FILMS, 1981, 76 (04) : L25 - L26
  • [24] THICK-FILM RESISTANCE TEMPERATURE DETECTORS
    EVANS, WD
    CONTROL AND INSTRUMENTATION, 1982, 14 (08): : 37 - &
  • [25] Thick-film resistive temperature sensors
    Dziedzic, A
    Golonka, LJ
    Kozlowski, J
    Licznerski, BW
    Nitsch, K
    MEASUREMENT SCIENCE AND TECHNOLOGY, 1997, 8 (01) : 78 - 85
  • [26] Thick-film resistive temperature sensors
    Technical Univ of Wroclaw, Wroclaw, Poland
    Meas Sci Technol, 1 (78-85):
  • [27] Lead-Free Solder for Assembly of Thick-Film Hybrid Modules for Use in High-Temperature Applications
    Shen, Zhenzhen
    Xu, Teng
    Johnson, R. Wayne
    Hamilton, Michael C.
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2016, 6 (03): : 373 - 382
  • [28] Thick-film gold and platinum conducing paths for high temperature electronics
    Jakubowska, Malgorzata
    Kalenik, Jerzy
    Kielbasinski, Konrad
    Mloniak, Anna
    Zwierkowska, Elzbieta
    PHOTONICS APPLICATIONS IN ASTRONOMY, COMMUNICATIONS, INDUSTRY, AND HIGH-ENERGY PHYSICS EXPERIMENTS 2007, PTS 1 AND 2, 2007, 6937
  • [29] THICK-FILM RESISTOR DIELECTRIC INTERACTIONS IN A LOW-TEMPERATURE COFIRED CERAMIC PACKAGE
    SUTTERLIN, RC
    DAYTON, GO
    BIGGERS, JV
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (02): : 346 - 352
  • [30] TEMPERATURE CONTROL OF THICK-FILM PRINTED HEATERS
    BENAMMAR, M
    MASKELL, WC
    JOURNAL OF PHYSICS E-SCIENTIFIC INSTRUMENTS, 1989, 22 (11): : 933 - 936