GRAIN-BOUNDARY DIFFUSION IN NI-CU MULTILAYER FILMS

被引：21
|
作者：
VENOS, R [1 ]
PALMER, W [1 ]
HOFFMANN, H [1 ]
机构：
[1] SIEMENS AG,DEPT ZT MTZ 13,D-8000 MUNICH 83,FED REP GER
来源：
THIN SOLID FILMS | 1988年 / 162卷 / 1-2期
关键词：
D O I：
10.1016/0040-6090(88)90203-9
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：155 / 160
页数：6
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