3-DIMENSIONAL ANALYSIS OF A HEAT-SPREADING PHENOMENON IN PHASE-LOCKED ARRAYS OF OXIDE-ISOLATED DIODE-LASERS

被引：8
|
作者：
NAKWASKI, W
机构：
[1] Institute of Physics, Technical University of Łódź, 93-005 Łódź
来源：
JOURNAL OF APPLIED PHYSICS | 1990年 / 67卷 / 06期
关键词：
D O I：
10.1063/1.345459
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
Three-dimensional analysis of a heat-spreading phenomenon in a heat sink of phase-locked arrays of oxide-isolated diode lasers is carried out in the present paper. The main result is that with increasing number of laser elements the heat-sink temperature increase turns out to change sublinearly whereas temperature differences between adjacent edge lasers increase considerably which threatens stability of the phase-locking operation. The heat spreading in semiconductor, contact, and solder layers was approximated by a one-dimensional model. The special correction factor (b) accounting for the two dimensionality of this heat spreading was used to improve the accuracy of the calculations.
引用
收藏
页码：2711 / 2715
页数：5
相关论文
共 20 条
12