THE EFFECTS OF PROCESSING PARAMETERS ON THE MICROSTRUCTURE AND PROPERTIES OF SPUTTER-DEPOSITED TIW THIN-FILM DIFFUSION-BARRIERS

被引：51
|
作者：
OPAROWSKI, JM [1 ]
SISSON, RD [1 ]
BIEDERMAN, RR [1 ]
机构：
[1] WORCESTER POLYTECH INST,DEPT MECH ENGN,WORCESTER,MA 01609
来源：
THIN SOLID FILMS | 1987年 / 153卷
关键词：
D O I：
10.1016/0040-6090(87)90192-1
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：313 / 328
页数：16
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