NEED AND POSSIBILITY OF LOW-TEMPERATURE POWER ELECTRONICS

被引:0
|
作者
MURAKAMI, Y [1 ]
YAMAMOTO, J [1 ]
机构
[1] OSAKA UNIV,FAC ENGN,APPL SUPERCOND LAB,SUITA,OSAKA 565,JAPAN
关键词
D O I
暂无
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
引用
收藏
页码:C427 / C427
页数:1
相关论文
共 50 条
  • [1] BASIC DISCUSSION ON LOW-TEMPERATURE POWER ELECTRONICS
    MURAKAMI, Y
    KIMURA, H
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1987, 26 : 1703 - 1704
  • [2] LOW-TEMPERATURE ELECTRONICS
    SWENSON, CA
    EMSLIE, AG
    PROCEEDINGS OF THE INSTITUTE OF RADIO ENGINEERS, 1954, 42 (02): : 408 - 413
  • [3] Profitability of low-temperature power electronics and potential applications
    Buettner, Stefanie
    Maerz, Martin
    CRYOGENICS, 2022, 121
  • [4] LOW-TEMPERATURE ELECTRONICS
    KIRSCHMAN, RK
    IEEE CIRCUITS & DEVICES, 1990, 6 (02): : 12 - 24
  • [5] Simplification of Low-Temperature Sintering Nanosilver for Power Electronics Packaging
    Mei, Yunhui
    Chen, Gang
    Cao, Yunjiao
    Li, Xin
    Han, Dan
    Chen, Xu
    JOURNAL OF ELECTRONIC MATERIALS, 2013, 42 (06) : 1209 - 1218
  • [6] Simplification of Low-Temperature Sintering Nanosilver for Power Electronics Packaging
    Yunhui Mei
    Gang Chen
    Yunjiao Cao
    Xin Li
    Dan Han
    Xu Chen
    Journal of Electronic Materials, 2013, 42 : 1209 - 1218
  • [7] Low-Temperature Joining Technique as Interconnection Technology for Power Electronics
    Amro, Raed
    ADVANCES IN INNOVATIVE MATERIALS AND APPLICATIONS, 2011, 324 : 437 - 440
  • [8] LOW-TEMPERATURE ELECTRONICS CONFERENCE
    不详
    PTB-MITTEILUNGEN, 1990, 100 (04): : 289 - 289
  • [9] LOW-TEMPERATURE ELECTRONICS, - COMMENT
    STRUM, PD
    PROCEEDINGS OF THE INSTITUTE OF RADIO ENGINEERS, 1955, 43 (02): : 227 - 227
  • [10] COOLING OF LOW-TEMPERATURE ELECTRONICS
    STEYERT, WA
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1987, 134 (8B) : C425 - C425