MULTICHIP MODULES

被引：0
|
作者：
BRUCE, RH
MEULI, WP
HO, J
机构：
来源：
26TH ACM/IEEE DESIGN AUTOMATION CONFERENCE | 1989年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：389 / 393
页数：5
相关论文
共 50 条
  • [1] MULTICHIP MODULES
    BUSCHBOM, M
    ELECTRONIC PRODUCTS MAGAZINE, 1991, 33 (09): : 43 - 44
  • [2] Cheap multichip modules
    Illyefalvi-Vitéz, Z
    Vervaet, A
    Van Calster, A
    Sinnadurai, N
    Hrovat, M
    Svasta, P
    Tóth, E
    Belavic, D
    Ionescu, R
    Dennehy, W
    INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS, 1999, 29 (02): : 71 - 78
  • [3] MULTICHIP MODULES MARCH ON
    CHIN, S
    ELECTRONIC PRODUCTS MAGAZINE, 1994, 36 (12): : 25 - 27
  • [4] FOREWORD - MULTICHIP MODULES
    TUCKERMAN, DB
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (04): : 600 - 600
  • [5] MICROWAVE MULTICHIP MODULES
    LEHTONEN, SJ
    MOORE, CR
    FRANCOMACARO, AS
    EDWARDS, RL
    CLATTERBAUGH, GV
    JOHNS HOPKINS APL TECHNICAL DIGEST, 1994, 15 (01): : 48 - 56
  • [6] Multichip modules for MAVs
    Bokulich, F
    AEROSPACE ENGINEERING, 2000, 20 (01) : 14 - 14
  • [7] Development of multichip modules
    Li, Zixue
    Tian, Dongfang
    Sun, Tairen
    Zhang, Junchao
    Fushe Yanjiu yu Fushe Gongyi Xuebao/Journal of Radiation Research and Radiation Processing, 1996, 14 (04): : 1 - 5
  • [8] Materials for multichip modules
    BBS PowerMod, Victor, United States
    Semicond Int, 6 (4pp):
  • [9] Wirebonding for multichip modules
    Charles, HK
    Mach, KJ
    Edwards, RL
    Lehtonen, SJ
    1996 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1996, 2920 : 420 - 425
  • [10] DESIGN OF MULTICHIP MODULES
    SCHAPER, LW
    PROCEEDINGS OF THE IEEE, 1992, 80 (12) : 1955 - 1964
12345