Research Progress of High Temperature Protective Coatings by Plasma Spray-Physical Vapor Deposition

Plasma spray-physical vapor deposition (PS-PVD) is a new multifunctional film and coating preparation technology developed based on low pressure plasma spraying, including plasma spray-physical vaper deposition technology, plasma spray-thin film technology and plasma spray-chemical vapor deposition technology. PS-PVD technology fills the gap between traditional physical vapor deposition technology and thermal spray technology, and brings the two technologies together. By varying the spray process parameters, coatings of different structures can be obtained. PS-PVD technology also has non-line-of-sight deposition characteristics, and its unique plasma jet characteristics allow the coating material to evaporate in the jet and deposit the gas phase particles under the jet. The research status of PS-PVD technology at home and abroad was introduced, and the difference between PS-PVD coating and traditional thermal barrier coating and its non-line-of-sight deposition characteristics were discussed. Currently, PS-PVD technology has also been applied to the preparation of environmental barrier coatings, simultaneously in the direction of preparing electrolyte layers for solid oxide fuel cells. Keywords: plasma spray-physical vaper deposition (PS-PVD); plasma jet simulation; thermal barrier coatings; non-line-of-sight deposition; environmental barrier coatings