RIGID-FLEXIBLE MULTILAYER CIRCUIT BOARDS - 3-DIMENSIONAL PRINTED-CIRCUITS ENABLE A FURTHER MINIATURIZATION AND INCREASE RELIABILITY

被引：0
|
作者：
ACKERMANN, D [1 ]
NITSCH, H [1 ]
机构：
[1] AEG TELEFUNKEN,FACHBEREICH WEITVERKEHR & KABEL TECH,DRUCK TECH ABT,D-7150 BACKNANG,FED REP GER
来源：
F&M-FEINWERKTECHNIK & MESSTECHNIK | 1976年 / 84卷 / 07期
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
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页码：317 / 320
页数：4
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