ABOUT "TECHNOLOGICAL" PROPERTIES OF NANO-SIZED NICKEL AND COPPER FILMS

被引:4
|
作者
Ivanov, D., V [1 ]
Antonov, A. S. [2 ]
Sdobnyakov, N. Yu [1 ]
Shimanskaya, H. N. [3 ,4 ]
Romanovskaia, E., V [4 ]
Afanasiev, M. S. [5 ,6 ]
机构
[1] Tver State Univ, Gen Phys Dept, Tver, Russia
[2] Tver State Univ, Tver, Russia
[3] Belarusian State Technol Univ, Dept Glass & Ceram Technol, Minsk, BELARUS
[4] Belarusian State Technol Univ, Dept Chem Technol Electrochem Prod & Elect Engn M, Minsk, BELARUS
[5] MIREA Russian Technol Univ, Moscow, Russia
[6] Russian Acad Sci, VA Kotelnikov Inst Radio Engn & Elect, Fryazino Branch, Minsk, BELARUS
关键词
scanning tunneling microscopy; nanorelief; fractal dimension; nanoscale films of nickel and copper; current-voltage characteristic; tunnel contact;
D O I
10.26456/pcascnn/2018.10.291
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
As an example of studying morphology of the relief of nickel and copper nano-sized films on the mica surface, it is possible to create a technology to "grow" structures with a given surface morphology using a scanning tunneling microscope. The characteristic features of the film surface nanorelief arc described, including fractal properties. The current-voltage characteristics of a metal-to-metal contact for nickel and copper films with a tungsten tip are obtained. It is shown that for surface areas containing fractal structures, the current-voltage characteristics may differ from the dependences obtained on ordinary surfaces.
引用
收藏
页码:291 / 303
页数:13
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