ELECTRODEPOSITION OF NICKEL INTO POROUS ALUMINA COMPACT

被引：4
|
作者：
HIRATA, Y
KYODA, H
IWAMOTO, T
HAMASAKI, K
机构：
来源：
JOURNAL OF THE CERAMIC SOCIETY OF JAPAN | 1995年 / 103卷 / 05期
关键词：
ELECTRODEPOSITION; NICKEL; ALUMINA; POROSITY;
D O I：
10.2109/jcersj.103.460
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Nickel was infiltrated into porous alumina compacts of 31-62% of theoretical density by electrochemical reaction of Ni2+ ions with direct and conical current in an aqueous solution of nickel nitrate/urea/ethylene glycol/ammonium sulfate. The weight of Ni deposited was in proportion to t(0.22-0.64) (t: deposition time). The deposition rate of Ni was higher for direct current than for conical current, and for a higher-porosity alumina compact. Use of conical current seemed to suppress the dendritic growth of Ni which was observed in a porous alumina with direct current.
引用
收藏
页码：460 / 463
页数：4
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