MICROSTRUCTURE OF DIFFUSION-BONDED JOINTS IN AL-LI 8090 ALLOY

被引：18
|
作者：
GILMORE, CJ
DUNFORD, DV
PARTRIDGE, PG
机构：
[1] Materials and Structures Department, Royal Aerospace Establishment, Farnborough
来源：
JOURNAL OF MATERIALS SCIENCE | 1991年 / 26卷 / 11期
关键词：
D O I：
10.1007/BF01124849
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Joints were produced between Al-Li 8090 alloy sheet by solid state (SSDB) and transient liquid-phase (TLPDB) diffusion-bonding techniques. The bond interface was a planar, thermally stable, large-angle grain boundary in the SSDB joint. Non-planar grain boundaries in a band of coarse grains were present in the TLPDB joint. The origin of these microstructures and the measured shear strengths of the joints relative to that of the parent sheet are discussed.
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收藏
页码：3119 / 3124
页数：6
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