THERMAL-PROCESS INDUCED STRESS IN THIN POLYIMIDE FILMS AND ITS ANALYSIS

被引:0
|
作者
BHOSALE, KS [1 ]
BHATTACHARYA, PK [1 ]
机构
[1] LOUISIANA STATE UNIV,DEPT ELECT ENGN,BATON ROUGE,LA 70803
关键词
D O I
暂无
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
引用
收藏
页码:35 / POLY
相关论文
共 50 条
  • [1] THERMAL-PROCESS FOR ORIENTATION OF POLYANILINE FILMS
    CROMACK, KR
    JOZEFOWICZ, ME
    GINDER, JM
    EPSTEIN, AJ
    MCCALL, RP
    DU, G
    LENG, JM
    KIM, K
    LI, C
    WANG, ZH
    DRUY, MA
    GLATKOWSKI, PJ
    SCHERR, EM
    MACDIARMID, AG
    MACROMOLECULES, 1991, 24 (14) : 4157 - 4161
  • [2] Stress behaviors and thermal properties of polyimide thin films depending on the different curing process
    Chung, H
    Lee, J
    Jang, W
    Shul, Y
    Han, H
    JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS, 2000, 38 (22) : 2879 - 2890
  • [3] ANALYSIS OF A PILOT THERMAL-PROCESS
    HASHIM, G
    RACHID, A
    HUMBERT, C
    SIMULATION APPLIED TO MANUFACTURING ENERGY AND ENVIRONMENTAL STUDIES AND ELECTRONICS AND COMPUTER ENGINEERING, 1989, : 181 - 187
  • [4] THERMAL-PROCESS EFFECTS ON NIFE AND NIFERH FILMS
    VALLETTA, RM
    HWANG, C
    LEFAKIS, H
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1991, 9 (04): : 2107 - 2112
  • [5] INTRINSIC AND THERMAL-STRESS IN POLYIMIDE THIN-FILMS
    REE, M
    KIRBY, DP
    POLYMERS FOR MICROELECTRONICS: RESISTS AND DIELECTRICS, 1994, 537 : 482 - 493
  • [6] Moisture-induced stress relaxation of polyimide thin films
    Chung, H
    Lee, C
    Han, H
    POLYMER, 2001, 42 (01) : 319 - 328
  • [7] Thermal diffusivity of aromatic polyimide thin films by temperature wave analysis
    Morikawa, Junko
    Hashimoto, Toshimasa
    JOURNAL OF APPLIED PHYSICS, 2009, 105 (11)
  • [8] A STATISTICAL APPROACH TO ERROR ANALYSIS IN THERMAL-PROCESS CALCULATIONS
    PATINO, H
    HEIL, JR
    JOURNAL OF FOOD SCIENCE, 1985, 50 (04) : 1110 - 1119
  • [9] ON THE ORIGIN OF RAPID THERMAL-PROCESS INDUCED RECOMBINATION CENTERS IN SILICON
    EICHHAMMER, W
    QUAT, VT
    SIFFERT, P
    JOURNAL OF APPLIED PHYSICS, 1989, 66 (08) : 3857 - 3865
  • [10] Thermal stress analysis for polyimide thin film: The effect of solvent evaporation
    Lee, SH
    Bae, YC
    MACROMOLECULAR THEORY AND SIMULATIONS, 2000, 9 (05) : 281 - 286