STUDIES OF COMPOUND FORMATION AT CU-IN, AG-IN AND AU-IN INTERFACES WITH PERTURBED GAMMA-GAMMA-ANGULAR CORRELATIONS

被引:50
|
作者
KEPPNER, W [1 ]
WESCHE, R [1 ]
KLAS, T [1 ]
VOIGT, J [1 ]
SCHATZ, G [1 ]
机构
[1] UNIV CONSTANCE,FAK PHYS,D-7750 CONSTANCE,FED REP GER
关键词
COPPER COMPOUNDS - GOLD AND ALLOYS - Thin Films - HEAT TREATMENT - Annealing - SILVER AND ALLOYS - Thin Films;
D O I
10.1016/0040-6090(86)90388-3
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The 0 behavior of the thin metal film couples Cu/In, 0 and Au/In was studied using the perturbed gamma - gamma angular correlation method. Formation of interface compounds CuIn//2, AgIn//2 35 and AuIn//2 was observed above temperatures T of 240 K, 220 K and 260 K respectively. The CuIn//2 and AgIn//2 compounds start to decompose above temperatures of 440 K and 460 K, though for AuIn//2 no decomposition was observed up to 550 K. Isothermal annealing of the film couples yielded a square root of time behavior for the average interface compound thickness, which supports the assumption of a diffusion-controlled growth mechanism. Diffusion constants D//0 and activation energies E//a are evaluated from an Arrhenius plot.
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页码:201 / 215
页数:15
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