VERIFICATION TOOL HANDLES MIXED-SIGNAL CHIPS

被引:0
|
作者
不详
机构
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:99 / 100
页数:2
相关论文
共 50 条
  • [1] Crossroads for mixed-signal chips
    Levin, PL
    Ludwig, R
    IEEE SPECTRUM, 2002, 39 (03) : 38 - +
  • [2] Reliability characterization of mixed-signal chips
    Abel, C
    Michael, C
    Ismail, M
    Teng, CS
    Lahri, R
    IEEE CIRCUITS & DEVICES, 1997, 13 (04): : 8 - 10
  • [3] Mixed-signal verification challenges
    Delorme, Nicolas
    2014 10TH CONFERENCE ON PH.D. RESEARCH IN MICROELECTRONICS AND ELECTRONICS (PRIME 2014), 2014,
  • [4] Mixed-signal ASIC tool
    Computer Design, 1991, 30 (12):
  • [5] On UVM Reliability in Mixed-Signal Verification
    Ramirez, Wilmer
    Gomez, Hector
    Roa, Elkim
    2019 IEEE 10TH LATIN AMERICAN SYMPOSIUM ON CIRCUITS & SYSTEMS (LASCAS), 2019, : 233 - 236
  • [6] Mixed-signal CNN array chips for image processing
    RodriguezVazquez, A
    Espejo, S
    DominguezCastro, R
    Carmona, R
    Roca, E
    ADVANCED FOCAL PLANE ARRAYS AND ELECTRONIC CAMERAS, 1996, 2950 : 218 - 229
  • [7] New mixed-signal tools target systems on chips
    Lipman, Jim
    EDN, 1999, 44 (12):
  • [8] Deploying the right tools for mixed-signal verification
    Ying, Geoffrey
    Electronic Engineering Times, 2006, (1427) : 28 - 30
  • [9] COMPLEX MIXED-SIGNAL CHIPS GET A UNIFIED TESTER
    MCLEOD, J
    ELECTRONICS-US, 1987, 60 (02): : 55 - 57
  • [10] A Mixed-Signal Physical Design and Its Verification
    Hu Yue-li
    Yan Ke
    2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, : 371 - 374