LOW LEAD, NO-LEAD, LEAN MIXTURES - BOON OR BANE TO ENGINE MATERIALS

被引：0
|
作者：
MISKA, KH
机构：
来源：
MATERIALS ENGINEERING | 1975年 / 81卷 / 05期
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：26 / 28
页数：3
相关论文
共 46 条
  • [1] NO-LEAD GAS TURNS INTO A WORLD BOON FOR MTBE
    REMIREZ, R
    CHEMICAL ENGINEERING, 1987, 94 (08) : 19 - &
  • [2] HYDROCARBON COMPOSITION OF LOS ANGELES MARKETED LOW-LEAD AND NO-LEAD GASOLINES
    MAYRSOHN, H
    BONAMASS.F
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1971, (MAR-A): : 88 - +
  • [3] KINETICS OF REDUCTION OF LEAD MINERALS AND COMMERCIAL LEAD BEARING MATERIALS BY CO CO2 GAS-MIXTURES
    HUSSAIN, MM
    MORRIS, DR
    JOURNAL OF METALS, 1985, 37 (08): : 57 - 61
  • [4] Lead-free, low-permittivity electrostrictor could be an alternative to lead-based materials
    Rao, Rahul
    MRS BULLETIN, 2024, 49 (05) : 413 - 413
  • [5] Comparative evaluation of erbium and lead regenerator materials for low temperature cryocoolers
    Wysokinski, TW
    Barclay, JA
    Gschneidner, KA
    Pecharsky, VK
    Pecharsky, AO
    CRYOGENICS, 2002, 42 (08) : 463 - 467
  • [6] Low-Frequency Raman Lines as an Indicator of the Presence of Lead in Oxide Materials
    V. E. Shukshin
    P. P. Fedorov
    M. E. Generalov
    Russian Journal of Inorganic Chemistry, 2019, 64 : 1442 - 1445
  • [7] A lead free, mixed metals low temperature cofire ceramic materials system
    ONeill, MP
    Modes, C
    1997 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 1997, 3235 : 512 - 516
  • [8] Low-Frequency Raman Lines as an Indicator of the Presence of Lead in Oxide Materials
    Shukshin, V. E.
    Fedorov, P. P.
    Generalov, M. E.
    RUSSIAN JOURNAL OF INORGANIC CHEMISTRY, 2019, 64 (11) : 1442 - 1445
  • [9] LOW-TEMPERATURE LUMINESCENCE DETERMINATION OF TELLURIUM AND LEAD IN SEMICONDUCTOR-MATERIALS
    SOLOVEV, EA
    SAVVINA, LP
    GOLOVINA, AP
    GRANOVSKII, YV
    JOURNAL OF ANALYTICAL CHEMISTRY OF THE USSR, 1975, 30 (01): : 83 - 85
  • [10] Development of Low-temperature Sintering Materials for Bare Cu lead-frame
    Fukazawa, Kazuki
    Mizumura, Noritsuka
    Saito, Satoshi
    Sasaki, Koji
    2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019), 2019, : 181 - 185
12345