TIME DOMAIN ANALYSIS OF CARBON NANOTUBE INTERCONNECTS BASED ON DISTRIBUTED RLC MODEL

被引:9
|
作者
Fathi, Davood [1 ]
Forouzandeh, Behjat [1 ]
机构
[1] Univ Tehran, Fac Engn, Nanoelect Ctr Excellence, Tehran, Iran
关键词
Carbon nanotube; interconnect; time domain response; transfer function; distributed model; delay; overshoot; ELECTRICAL-PROPERTIES; PERFORMANCE ANALYSIS; PHONON-SCATTERING; RESISTANCE;
D O I
10.1142/S1793292009001484
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
This paper introduces an accurate analysis of time domain response of carbon nanotube (CNT) interconnects based on distributed RLC model that takes the effect of both the series resistance and the output parasitic capacitance of the driver into account. Using rigorous principle calculations, accurate expressions for the transfer function of these lines and their time domain response have been presented. It has been shown that the second-order transfer function cannot represent the distributed behavior of the long CNT interconnects, and the fourth-order approximation offers a better result. Also, the time response of a driven long CNT interconnect versus length and diameter have been studied. The obtained results show that the overshoot increases and the time delay decreases with increasing the CNT diameter, such that with the diameter value of 10 nm for a 3.3 mm CNT interconnect, the maximum overshoot value reaches about 95% of the amplitude of the driver input. On the contrary, the overshoot increases and the time delay decreases with decreasing the length of the CNT, such that with the length value of 1 mm for a 5 nm diameter CNT interconnect, the maximum overshoot reaches about 90% of the amplitude of the driver input.
引用
收藏
页码:13 / 21
页数:9
相关论文
共 50 条
  • [1] Time-Domain Analysis of Coupled Carbon Nanotube Interconnects
    Fathi, Davood
    JOURNAL OF NANOTECHNOLOGY, 2014, 2014
  • [2] Time-Domain Finite-Difference based Analysis of Induced Crosstalk in Multiwall Carbon Nanotube Interconnects
    Kumar, Amit
    Nehra, Vikas
    Kaushik, Brajesh Kumar
    NANOENGINEERING: FABRICATION, PROPERTIES, OPTICS, AND DEVICES XIV, 2017, 10354
  • [3] Modeling and Analysis of Crosstalk for Distributed RLC Interconnects using Difference Model Approach
    Ravindra, J. V. R.
    Srinivas, M. B.
    SBCCI2007: 20TH SYMPOSIUM ON INTEGRATED CIRCUITS AND SYSTEMS DESIGN, 2007, : 207 - 211
  • [4] A model for carbon nanotube interconnects
    Xu, Y.
    Srivastava, A.
    INTERNATIONAL JOURNAL OF CIRCUIT THEORY AND APPLICATIONS, 2010, 38 (06) : 559 - 575
  • [5] Performance analysis for randomly distributed mixed carbon nanotube bundle interconnects
    Majumder, Manoj Kumar
    Kumar, Jainender
    Kumar, Vobulapuram Ramesh
    Kaushik, Brajesh Kumar
    MICRO & NANO LETTERS, 2014, 9 (11): : 792 - 796
  • [6] Wave-propagation based analytical model for distributed on-chip RLC interconnects
    Kadim, H. J.
    Coulibaly, L. M.
    2006 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOLS 1-11, PROCEEDINGS, 2006, : 4159 - +
  • [7] Analysis of on-chip inductance effects for distributed RLC interconnects
    Banerjee, K
    Mehrotra, A
    IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2002, 21 (08) : 904 - 915
  • [8] Carbon nanotube based VLSI interconnects: Analysis and design
    Kaushik, Brajesh Kumar
    Majumder, Manoj Kumar
    SpringerBriefs in Applied Sciences and Technology, 2015, 0 (9788132220466):
  • [9] A General Approach for Sensitivity Analysis of Distributed Interconnects in the Time Domain
    Nakhla, Natalie
    Nakhla, Michel
    Achar, Ramachandra
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2011, 59 (01) : 46 - 55
  • [10] A Thermal Model for Carbon Nanotube Interconnects
    Mohsin, Kaji Muhammad
    Srivastava, Ashok
    Sharma, Ashwani K.
    Mayberry, Clay
    NANOMATERIALS, 2013, 3 (02) : 229 - 241