THERMAL SIMULATION OF INTEGRATED DIGITAL TRANSDUCERS

被引：4
|
作者：
STEGER, U
REICHL, H
机构：
[1] Fraunhofer-Inst fuer, Festkoerpertechnologie, Munich, West, Ger, Fraunhofer-Inst fuer Festkoerpertechnologie, Munich, West Ger
来源：
SENSORS AND ACTUATORS | 1983年 / 4卷 / 04期
关键词：
DIGITAL DEVICES - Analysis - INTEGRATED CIRCUITS; DIGITAL - Mathematical Models - MATHEMATICAL TECHNIQUES - Finite Difference Method - SENSORS - Mathematical Models;
D O I：
10.1016/0250-6874(83)85076-8
中图分类号：
O65 [分析化学];
学科分类号：
070302 ; 081704 ;
摘要：
Two main limiting factors exist for the monolithic integration of semiconductor sensors and electronic circuits: the yield and the self-heating. In this paper, the thermal behavior of monolithically-integrated silicon transducers with thin membranes is analyzed. The mathematical solution of the heat-conduction equation under these special conditions is carried out by the finite difference method. The influence of various parameters on the thermal behavior is discussed. Some examples of appropriate thermal designs for integrated digital pressure sensor chips are given.
引用
收藏
页码：621 / 627
页数：7
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