APPLICATION OF THERMOANALYSIS TO THICK-FILM MATERIALS DEVELOPMENT

被引:0
|
作者
PARKER, J
GALLAGHER, B
机构
[1] ELECTRINK INC,SAN DIEGO,CA 92121
[2] CALTECH,JET PROP LAB,PASADENA,CA 91109
关键词
D O I
暂无
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
引用
收藏
页码:C87 / C87
页数:1
相关论文
共 50 条
  • [1] MATERIALS DEVELOPMENT IMPROVES THICK-FILM RELIABILITY
    CUMMINS, R
    ELECTRONIC ENGINEERING, 1973, 45 (540): : 61 - 61
  • [2] THICK-FILM MATERIALS
    SETTY, MS
    ELECTRONICS INFORMATION & PLANNING, 1981, 8 (06): : 436 - 438
  • [3] THICK-FILM MATERIALS FOR HYBRIDS
    COLEMAN, M
    RADIO AND ELECTRONIC ENGINEER, 1982, 52 (05): : 227 - 234
  • [4] TRENDS IN THICK-FILM MATERIALS
    MONES, AH
    ROSENBERG, RM
    SOLID STATE TECHNOLOGY, 1976, 19 (10) : 47 - 49
  • [5] THICK-FILM MATERIALS AND RELIABILITY
    GRAVES, PW
    ELECTRICAL COMMUNICATION, 1982, 57 (02): : 127 - 131
  • [6] THICK-FILM MATERIALS AND TECHNIQUES.
    Ulrich, Donald R.
    Electronic Packaging and Production, 1974, 14 (07): : 276 - 285
  • [7] THICK-FILM TECHNOLOGY - AN INTRODUCTION TO THE MATERIALS
    LARRY, JR
    ROSENBERG, RM
    UHLER, RO
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1980, 3 (02): : 211 - 225
  • [8] AN OVERVIEW OF THICK-FILM HYBRID MATERIALS
    HOFFMAN, LC
    AMERICAN CERAMIC SOCIETY BULLETIN, 1984, 63 (04): : 572 - 576
  • [9] MATERIALS SCIENCE OF THICK-FILM TECHNOLOGY
    VEST, RW
    AMERICAN CERAMIC SOCIETY BULLETIN, 1986, 65 (04): : 631 - 636
  • [10] COPPER THICK-FILM MATERIALS - A PERSPECTIVE
    COX, JJ
    SOLID STATE TECHNOLOGY, 1980, 23 (10) : 150 - 152