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- [2] THE EFFECT OF LEAD AND IRON IONS ON COPPER ELECTRODEPOSITED FROM A PYROPHOSPHATE BATHSURFACE AND INTERFACE ANALYSIS, 1988, 12 (1-12) : 441 - 443DEFILIPPO, DDESSI, LROSSI, A
- [3] EFFECT OF BATH COMPOSITION AND PLATING VARIABLES ON COPPER PLATING INTO SMALL HOLESJOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1975, 122 (08) : C255 - C255TURNER, DRHAVENS, BR
- [4] THE EFFECT OF ULTRASONIC AGITATION ON COPPER PLATING IN AN ACID BATHPLATING AND SURFACE FINISHING, 1989, 76 (03): : 46 - 50HSIAO, MCWAN, CC
- [6] COPPER PLATING BATH MONITORJOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1977, 124 (08) : C302 - C302MANSFELD, F
- [7] Electrodeposited copper foil for fine patternTransactions of the Institute of Metal Finishing, 2000, 78 (04):Nakaoka, Tadao
- [8] Development of new electrodeposited copper foilTRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 1996, 74 : 133 - 137Onfroy, GSaida, M
- [9] Electrodeposited copper foil for fine patternTRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 2000, 78 : 51 - 54Nakaoka, T
- [10] MORPHOLOGY OF COPPER ELECTRODEPOSITED FROM ACID COPPER SULPHATE BATH WITH CL- IONS ON COPPER (110) FACECURRENT SCIENCE, 1970, 39 (21): : 483 - &NAGESWAR, SSETTY, THV