COPPER-NICKEL INTERFACE FORMATION

被引:0
|
作者
YANG, S [1 ]
FENG, XH [1 ]
YU, MR [1 ]
GARFUNKEL, E [1 ]
机构
[1] RUTGERS STATE UNIV,DEPT CHEM,PISCATAWAY,NJ 08855
关键词
D O I
暂无
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
引用
收藏
页码:26 / COLL
相关论文
共 50 条
  • [1] ON THE HEATS OF FORMATION OF COPPER-NICKEL ALLOYS
    LEACH, JSL
    BEVER, MB
    TRANSACTIONS OF THE AMERICAN INSTITUTE OF MINING AND METALLURGICAL ENGINEERS, 1959, 215 (04): : 728 - 729
  • [2] STUDY OF THE FORMATION OF COPPER-NICKEL ASYMMETRIC CATALYSTS
    VEDENYAPIN, AA
    CHANKVETADZE, BG
    AKIMOV, VM
    KLABUNOVSKII, EI
    BULLETIN OF THE ACADEMY OF SCIENCES OF THE USSR DIVISION OF CHEMICAL SCIENCE, 1988, 37 (10): : 1988 - 1991
  • [3] FORMATION AND STRUCTURE OF EVAPORATED COPPER-NICKEL ALLOY FILMS
    BYRNE, JJ
    CLARKE, JKA
    JOURNAL OF CATALYSIS, 1967, 9 (02) : 166 - &
  • [4] THE SURFACE OF COPPER-NICKEL CATALYST .2. ADSORPTION OF HYDROGEN ON COPPER, NICKEL, AND COPPER-NICKEL CATALYSTS
    TAKEUCHI, T
    SAKAGUCHI, M
    BULLETIN OF THE CHEMICAL SOCIETY OF JAPAN, 1957, 30 (02) : 182 - 186
  • [5] Copper-nickel dealloying
    不详
    MATERIALS PERFORMANCE, 1999, 38 (06) : 85 - 85
  • [6] Thermal Stability of Copper-Nickel and Copper-Nickel Silicide Contacts for Crystalline Silicon
    Kale, Abhijit S.
    Nemeth, William
    Perkins, Craig L.
    Young, David
    Marshall, Alexander
    Florent, Karine
    Kurinec, Santosh K.
    Stradins, Paul
    Agarwal, Sumit
    ACS APPLIED ENERGY MATERIALS, 2018, 1 (06): : 2841 - 2848
  • [7] FORMATION OF COPPER-NICKEL AND ZINC-NICKEL HYDROSILICATE COMPOUNDS IN AMMONIA SOLUTIONS
    ALEKSEEVA, IP
    KOROLEVA, EB
    DUSHINA, AP
    ALESKOVSKII, VB
    ZHURNAL OBSHCHEI KHIMII, 1977, 47 (11): : 2401 - 2410
  • [8] SPECIFIC HEAT OF COPPER NICKEL AND COPPER-NICKEL ALLOYS
    PAWEL, RE
    STANSBUR.EE
    JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1965, 26 (03) : 607 - &
  • [9] DIFFERENTIAL MOBILITY OF COMPONENTS IN FORMATION OF SULFIDE COPPER-NICKEL ORES
    GODLEVSK.MN
    GEOCHEMISTRY INTERNATIONAL USSR, 1967, 4 (01): : 188 - &
  • [10] Peculiarities of the formation of the microrelief of copper-cobalt and copper-nickel plating alloys
    Kharlamov, VI
    Belous, OM
    Grigoryan, NS
    Terekhova, VV
    Vagramyan, TA
    RUSSIAN JOURNAL OF ELECTROCHEMISTRY, 1997, 33 (01) : 84 - 86