Improvement of Breakdown Characteristics of a GaN HEMT with AlGaN Buffer Layer

被引:0
|
作者
Y. Chen
Y. Jiang
P.Q. Xu
Z.G. Ma
X.L. Wang
T. He
M.Z. Peng
W.J. Luo
X.Y. Liu
L. Wang
H.Q. Jia
H. Chen
机构
[1] Chinese Academy of Sciences,Beijing National Laboratory of Condensed Matter Physics, Institute of Physics
[2] Chinese Academy of Sciences,Key Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics
来源
关键词
HEMT; AlGaN buffer; off-state breakdown voltage; MOCVD;
D O I
暂无
中图分类号
学科分类号
摘要
High-electron-mobility transistors (HEMTs) with a highly resistive two-layer buffer layer (AlGaN/GaN) were grown on 6H-SiC substrates by metalorganic chemical vapor deposition. The characteristics were compared with those of conventional HEMTs utilizing GaN as the high-resistivity buffer. The results of x-ray diffraction and atomic force microscopy indicate that the crystal quality of the HEMT heterostructure is not deteriorated by the AlGaN buffer layer. The direct-current (DC) characteristics of the HEMTs with the two different structures are similar, while the off-state breakdown voltage is enhanced and the mobility of the two-dimensional electron gas is improved by the AlGaN buffer layer. The reasons for the effects of the AlGaN buffer layer are discussed systematically.
引用
收藏
页码:471 / 475
页数:4
相关论文
共 50 条
  • [1] Improvement of Breakdown Characteristics of a GaN HEMT with AlGaN Buffer Layer
    Chen, Y.
    Jiang, Y.
    Xu, P. Q.
    Ma, Z. G.
    Wang, X. L.
    He, T.
    Peng, M. Z.
    Luo, W. J.
    Liu, X. Y.
    Wang, L.
    Jia, H. Q.
    Chen, H.
    JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (03) : 471 - 475
  • [2] Improvement of breakdown and current collapse characteristics of GaN HEMT with a polarization-graded AlGaN buffer
    Li, Chuanhao
    Li, Zhonghui
    Peng, Daqing
    Ni, Jinyu
    Pan, Lei
    Zhang, Dongguo
    Dong, Xun
    Kong, Yuechan
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2015, 30 (03)
  • [3] Improvement of conductivity and breakdown characteristics of AlGaN/GaN HEMT structures in passivation experiments
    Shapoval, S
    Gurtovoi, V
    Kovalchuk, A
    Eastman, L
    Vertjachih, A
    Gaquiere, C
    Theron, D
    10TH INTERNATIONAL SYMPOSIUM ON NANOSTRUCTURES: PHYSICS AND TECHNOLOGY, 2003, 5023 : 90 - 93
  • [4] An AlGaN/GaN HEMT by the periodic pits in the buffer layer
    Jaghargh, Sadaf S. Sajjadi
    Orouji, Ali A.
    PHYSICA SCRIPTA, 2019, 94 (10)
  • [5] Improvement of breakdown characteristics in AlGaN/GaN/AlxGa1-xN HEMT based on a grading AlxGa1-xN buffer layer
    Yu, Hongbo
    Lisesivdin, Sefer B.
    Bolukbas, Basar
    Kelekci, Ozgur
    Ozturk, Mustafa Kemal
    Ozcelik, Suleyman
    Caliskan, Deniz
    Ozturk, Mustafa
    Cakmak, Huseyin
    Demirel, Pakize
    Ozbay, Ekmel
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2010, 207 (11): : 2593 - 2596
  • [6] Investigation of the Influence of the Buffer Layer Design in a GaN HEMT Transistor on the Breakdown Characteristics
    Kurbanbaeva D.M.
    Lashkov A.V.
    Tsarik K.A.
    Russian Microelectronics, 2023, 52 (Suppl 1) : S14 - S19
  • [7] Breakdown voltage improvement of enhancement mode AlGaN/GaN HEMT by a novel step-etched GaN buffer structure
    Wu, Hao
    Fu, Xiaojun
    Wang, Yuan
    Guo, Jingwei
    Shen, Jingyu
    Hu, Shengdong
    RESULTS IN PHYSICS, 2021, 29
  • [8] Optimisation of a carbon doped buffer layer for AlGaN/GaN HEMT devices
    Gamarra, Piero
    Lacam, Cedric
    Tordjman, Maurice
    Splettstoesser, Joerg
    Schauwecker, Bernd
    di Forte-Poisson, Marie-Antoinette
    JOURNAL OF CRYSTAL GROWTH, 2015, 414 : 232 - 236
  • [9] Simulation design of a high-breakdown-voltagep-GaN-gate GaN HEMT with a hybrid AlGaN buffer layer for power electronics applications
    Liu, Yong
    Yu, Qi
    Du, Jiangfeng
    JOURNAL OF COMPUTATIONAL ELECTRONICS, 2020, 19 (04) : 1527 - 1537
  • [10] Characteristics Improvement of AlGaN/GaN MOS-HEMT by Thickness and Doping Concentration Variation of GaN Doped Layer
    Karmokar, Nibedita
    Khan, Faiaz
    Sabrina, Samia
    2019 5TH IEEE INTERNATIONAL WIE CONFERENCE ON ELECTRICAL AND COMPUTER ENGINEERING (WIECON-ECE 2019), 2019,