An Integrated CAD Methodology for Yield Enhancement of VLSI CMOS Circuits Including Statistical Device Variations

被引:0
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作者
Massimo Conti
Paolo Crippa
Simone Orcioni
Marcello Pesare
Claudio Turchetti
Loris Vendrame
Silvia Lucherini
机构
[1] Universita Politecnica deele Marche,Dipartimento di Elettronica, Intelligenza Artificiale e Telecommunicazionis
[2] MPG Flash CAD STMicroelectronics,undefined
[3] CR&D STMicroelectronics,undefined
关键词
parametric yield; device mismatch; optimization; statistical process variations; CAD tool;
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学科分类号
摘要
In this paper a novel CAD methodology for yield enhancement of VLSI CMOS circuits including random device variations is presented. The methodology is based on a preliminary characterization of the technological process by means of specific test chips for accurate mismatch modeling. To this purpose, a very accurate position-dependent parameter mismatch model has been formulated and extracted. Finally a CAD tool implementing this model has been developed. The tool is fully integrated in an environment of existing commercial tools and it has been experimented in the STMicroelectronics Flash Memory CAD Group.
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页码:85 / 102
页数:17
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