Effects of microrolling parameters on the microstructure and deformation behavior of pure copper

被引:0
|
作者
Yi Jing
Hong-mei Zhang
Hao Wu
Lian-jie Li
Hong-bin Jia
Zheng-yi Jiang
机构
[1] University of Science and Technology Liaoning,School of Material and Metallurgy
[2] University of Wollongong,School of Mechanical, Materials and Mechatronic Engineering
[3] Da-Xing Plant,An
关键词
micro-rolling; grain size effect; reduction; deformation behavior; microstructure; pure copper;
D O I
暂无
中图分类号
学科分类号
摘要
Microrolling experiments and uniaxial tensile tests of pure copper under different annealing conditions were carried out in this paper. The effects of grain size and reduction on non-uniform deformation, edge cracking, and microstructure were studied. The experimental results showed that the side deformation became more non-uniform, resulting in substantial edge bulge, and the uneven spread increased with increasing grain size and reduction level. When the reduction level reached 80% and the grain size was 65 μm, slight edge cracks occurred. When the grain size was 200 μm, the edge cracks became wider and deeper. No edge cracks occurred when the grain size was 200 μm and the reduction level was less than 60%; edge cracks occurred when the reduction level was increased to 80%. As the reduction level increased, the grains were gradually elongated and appeared as a sheet-like structure along the rolling direction; a fine lamellar structure was obtained when the grain size was 20 μm and the reduction level was less than 60%.
引用
收藏
页码:45 / 52
页数:7
相关论文
共 50 条
  • [1] Effects of microrolling parameters on the microstructure and deformation behavior of pure copper
    Jing, Yi
    Zhang, Hong-mei
    Wu, Hao
    Li, Lian-Jie
    Jia, Hong-bin
    Jiang, Zheng-yi
    INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS, 2018, 25 (01) : 45 - 52
  • [2] Effects of microrolling parameters on the microstructure and deformation behavior of pure copper
    Yi Jing
    Hong-mei Zhang
    Hao Wu
    Lian-jie Li
    Hong-bin Jia
    Zheng-yi Jiang
    InternationalJournalofMineralsMetallurgyandMaterials, 2018, 25 (01) : 45 - 52
  • [3] Deformation behavior, microstructure and mechanical properties of pure copper subjected to tube hydroforming
    Chen, Mingtao
    Xiao, Xiaoting
    Guo, Heng
    Tong, Jianghuai
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2018, 731 : 331 - 343
  • [4] Microstructure evolution, hardening and thermal behavior of commercially pure copper subjected to torsion deformation
    Wang, Chengpeng
    Li, Fuguo
    Li, Jinghui
    Dong, Junzhe
    Xue, Fengmei
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2014, 598 : 7 - 14
  • [5] Size effects on plastic deformation behavior in micro radial compression of pure copper
    Cheng, Li-dong
    Wang, Chuan-jie
    Wang, Chun-ju
    Guo, Bin
    Wang, Zhen-long
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2013, 23 (09) : 2686 - 2691
  • [6] Effects of electric current on the plastic deformation behavior of pure copper, iron, and titanium
    Rudolf, C.
    Goswami, R.
    Kang, W.
    Thomas, J.
    ACTA MATERIALIA, 2021, 209
  • [7] Evolution of microstructure and deformation behavior of pure iron by severe plastic deformation
    Han, BQ
    Chiou, WA
    Lavernia, EJ
    Mohamed, FA
    ELECTRON MICROSCOPY: ITS ROLE IN MATERIALS SCIENCE: THE MIKE MESHII SYMPOSIUM, 2003, : 209 - 216
  • [8] Effect of torsional deformation on microstructure and mechanical properties of pure copper
    Zhang, Mingxue
    Wang, Bingshu
    Deng, Liping
    Wu, Hanqun
    MATERIALS CHARACTERIZATION, 2024, 214
  • [9] Compression Deformation Behavior and Processing Map of Pure Copper
    S. H. Huang
    S. X. Chai
    X. S. Xia
    Q. Chen
    D. Y. Shu
    Strength of Materials, 2016, 48 : 98 - 106
  • [10] Compression Deformation Behavior and Processing Map of Pure Copper
    Huang, S. H.
    Chai, S. X.
    Xia, X. S.
    Chen, Q.
    Shu, D. Y.
    STRENGTH OF MATERIALS, 2016, 48 (01) : 98 - 106