Improving thermal conductivity of poly(aryl ether nitrile ketone) composites by incorporating functionalized boron nitride and silicon carbide via electrospinning-hot press method

In this study, through blending solutions and followed by electrospinning with hot press technique, poly(aryl ether nitrile ketone), boron nitride and silicon carbide (PEK-CN/BN/SiC) composites were fabricated. Functionalized boron nitride (BN) with different sizes by Octadecyltrimethylammonium Bromide (OTAB) and surface-modified silicon carbide (SiC) by γ-(2,3-epoxypropoxy) trimethoxy silane (KH560) were performed as the fillers. The results herein indicate that under the same condition and size of the fillers, the thermal conductivity coefficient (λ) of PEK-CN/BN/SiC composites with incorporating functionalized BN and SiC were both higher than the composites with unfunctionalized BN and SiC. When the condition of the fillers were 20wt% OTAB-BN (12,500 mesh) and 10wt% KH560-SiC, compared with the pure PEK-CN, the glass transition temperature (Tg) of the composites was increased from 228.1 ℃ to 232.4 ℃. A rise in the thermal conductivity coefficient (λ), from 0.251 W/mK to 0.812 W/mK was observed. Moreover, the thermal stability of PEK-CN/BN/SiC composites was enhanced likewise.